H - Electricity
01
L
H01L 21/50 (2006.01) H01L 23/34 (2006.01) H01L 23/488 (2006.01) H01L 23/50 (2006.01)
Patent
CA 2647863
An RF/IPD package with improved thermal management is described. The IPD substrate is attached to a system substrate with a thin RF chip mounted in the standoff between the IPD substrate and the system substrate. RF interconnections are made between the top of the RF chip and the bottom of the IPD substrate. Heat sinking is provided by bonding a heat sink layer on the RF chip to a heat sink layer on the system substrate. The heat sink may also serve as a ground plane connection. Combinations of other types of integrated devices may be fabricated using this approach.
Degani Yinon
Fan Yu
Gao Charley Chunlei
Sun Kunquan
Sun Liquo
Kirby Eades Gale Baker
Sychip Inc.
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