C - Chemistry – Metallurgy – 09 – D
Inventor
C - Chemistry, Metallurgy
09
D
Inventor
Country: United States Of America
Integrated circuit bonding method and apparatus
Mcm packages
Movable fiber optical switch
Packaging micromechanical devices
Packaging multi-chip modules without wire-bond interconnection
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Profile ID: LFCA-PAI-P-1218026