Metal redistribution layer having solderable pads and wire...

Details Metal redistribution layer having solderable pads and wire... Metal redistribution layer having solderable pads and wire...

H - Electricity

01

L

H01L 23/525 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2388926

A redistribution metallization scheme combines solder bumps (122) and wire bond pads (132) in addition to existing bond pads (102) to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition step. The metals (204, 206, 208) used in the redistribution layer provide a solderable surface for solder bumping and a bondable surface for wire bonding.

L'invention concerne une méthode de métallisation par redistribution, qui combine des bossages (122) de soudure et des plages (132) de connexion par fils, de manière complémentaire à des plages (102) de connexion existantes pour améliorer la connectivité d'un dispositif semi-conducteur, spécialement dans des applications de connexion par bosses. Le procédé de fabrication comporte les étapes consistant à former les plages de connexion supplémentaires au cours de l'étape de dépôt par redistribution. Les métaux (204, 206, 208) utilisés dans la couche de redistribution fournissent une surface brasable pour la soudure des bossages et une surface soudable pour la connexion des fils.

Affiliated with

Also associated with

Rating

Metal redistribution layer having solderable pads and wire... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal redistribution layer having solderable pads and wire..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal redistribution layer having solderable pads and wire... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1523263