Metal redistribution layer having solderable pads and wire...

H - Electricity – 01 – L

Patent

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Details

H01L 23/525 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2388926

A redistribution metallization scheme combines solder bumps (122) and wire bond pads (132) in addition to existing bond pads (102) to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition step. The metals (204, 206, 208) used in the redistribution layer provide a solderable surface for solder bumping and a bondable surface for wire bonding.

L'invention concerne une méthode de métallisation par redistribution, qui combine des bossages (122) de soudure et des plages (132) de connexion par fils, de manière complémentaire à des plages (102) de connexion existantes pour améliorer la connectivité d'un dispositif semi-conducteur, spécialement dans des applications de connexion par bosses. Le procédé de fabrication comporte les étapes consistant à former les plages de connexion supplémentaires au cours de l'étape de dépôt par redistribution. Les métaux (204, 206, 208) utilisés dans la couche de redistribution fournissent une surface brasable pour la soudure des bossages et une surface soudable pour la connexion des fils.

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