H - Electricity
01
L
Inventor
Country: United States Of America
Dual-die integrated circuit package
Integrated circuit package formed at a wafer level
Metal redistribution layer having solderable pads and wire...
Method of forming a stacked-die integrated circuit chip...
Method of forming an integrated circuit package at a wafer...
No associations
LandOfFree
Ken M. Lam does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Ken M. Lam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ken M. Lam will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-P-1590174