Method and apparatus for handling and processing wafer like...

Details Method and apparatus for handling and processing wafer like... Method and apparatus for handling and processing wafer like...

H - Electricity

01

L

201/77

H01L 21/00 (2006.01) H01L 21/677 (2006.01)

Patent

CA 1287594

ABSTRACT OF THE DISCLOSURE The apparatus is provided with a main chamber divided into two chamber halves by a rotatable index plate. The plate rotates through a load lock station, through which wafer-like articles are inserted into and removed from the main chamber, and a series of processing stations, at each of which a process such as etching or sputter coating can be performed simultaneously upon different objects and sequentially upon the same objects. Each processing chamber is isolatable from the main chamber and other processing chambers during processing so that different substrates can be processed simultaneously at the various stations using different processes without cross contamination. Substrate holders resiliently mounted on the plate move transversely when compressed between a cup shaped back-plane device and the main chamber wall to separately seal each of the processing chambers from the main chamber.

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