Method and apparatus for introducing normally solid...

Details Method and apparatus for introducing normally solid... Method and apparatus for introducing normally solid...

H - Electricity

01

L

356/176, 356/192

H01L 21/265 (2006.01) C23C 8/36 (2006.01) C23C 14/32 (2006.01) C23C 14/48 (2006.01) C23C 14/54 (2006.01) H01J 37/32 (2006.01)

Patent

CA 1212486

ABSTRACT OF THE DISCLOSURE Method and apparatus for introducing normally solid metals or metalloids into electrically conductive substrates. The invention is particularly useful in surface alloying of metal substrates and makes it possible to intro- duce such metals as tungsten into ferrous metal substrates to diffused depths of 100 microns and more without undue expense. The metal or metalloid to be introduced is main- tained at an elevated temperature below the boiling point but equal to at least 40% of the melting point, the surface portion of the substrate is maintained at an elevated temper- ature below the deformation point, and a double glow dis- charge is employed under controlled conditions to transfer the metal or metalloid to the substrate.

454950

Affiliated with

Also associated with

Rating

Method and apparatus for introducing normally solid... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for introducing normally solid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for introducing normally solid... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1285350