Method and apparatus for joining plates by stamping pressing...

B - Operations – Transporting – 21 – D

Patent

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26/29, 113/70

B21D 39/03 (2006.01)

Patent

CA 1307169

ABSTRACT OF THE DISCLOSURE A method for joining stacked thin plates (metal sheets in particular) or plate sections by stamping dies, and an apparatus for performing the method, in which stacked plate portions are severed by stamping them along a longitudinal portion of their peripheries and pressed them out of the plane of the plate, and in which subsequently, by means of a counter- pressure die element, the plate portion nearer the plates is enlarged on the cut sides by swaging, yet without the plate portion remote from the plates being enlarged. Further, during the stamping and pressing operation the counterpressure die element, or the swaging die, remains stationary inside the bottom die 2, but subsequently, during the coining operation that generates higher pressing forces, the yields counter to an elastic supporting force, whereupon the flowing material of the plate piece nearer the plates forms flange portions which grip the plate associated with it from behind.

518161

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