H - Electricity – 01 – C
Patent
H - Electricity
01
C
H01C 17/065 (2006.01) H05B 3/00 (2006.01)
Patent
CA 2720741
An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate.
Cette invention concerne un appareil destiné au positionnement dune couche de préforme en forme de bande sur un substrat au cours de la fabrication dun dispositif résistif multicouche. Ledit appareil comprend au moins un élément de positionnement, qui délimite une partie extrémité proximale et une partie extrémité distale. Il comporte également un élément de contact grâce auquel le substrat et la préforme en forme de bande entrent en prise. Ledit élément de contact et la partie extrémité distale de lélément de positionnement sont conçus pour permettre le positionnement de ladite préforme sur le substrat.
Brummell Roger
Forbis Larry
Gaulke Ken
Lamantia Tom
Miller Jason
Gowling Lafleur Henderson Llp
Watlow Electric Manufacturing Company
LandOfFree
Method and apparatus for positioning layers within a layered... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for positioning layers within a layered..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for positioning layers within a layered... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1529762