C - Chemistry – Metallurgy – 03 – C
Patent
C - Chemistry, Metallurgy
03
C
C03C 17/32 (2006.01) C03C 17/34 (2006.01)
Patent
CA 2531357
A curable composition including a curable organic binder and particles is disclosed. The particles are rigid at or below a first temperature and become soft at temperatures at which the organic binder is cured. Methods for printing substrates are also disclosed.
Composition durcissante comprenant un liant organique durcissant et des particules. Ces particules sont rigides à une première température ou à une température inférieure à cette première température et se ramollissent à des températures auxquelles le liant organique est durci. Procédés d'impression de substrats.
Nehmsmann Louis J.
Tang Robert H.
Wang Alan E.
Zhang Yingchao C.
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
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