H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/28 (2006.01) B29C 33/68 (2006.01) B29C 70/72 (2006.01) H01L 21/56 (2006.01) B29C 33/00 (2006.01)
Patent
CA 2180595
Method for encapsulating, in a mould, an electronic component having a number of laterally projecting elongated connecting elements situated next to one another in one plane, said connecting elements being without metallic through connection and having a certain mutual pitch (PL), width (WL) and height (TL), and with the insertion of two films, each having a predetermined thickness (TFT and TFB, respectively), a deformable film being used and the encapsulation being carried out under conditions which are such that, during the process, the condition Image at the position of the clamping edges of the matrix parts is met, while C 2.5.
Pas Ireneus Johannes Theodorus Maria
Vos Eltjo
"3p" Licensing B.v.
Gowling Lafleur Henderson Llp
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