B - Operations – Transporting – 05 – D
Patent
B - Operations, Transporting
05
D
356/6, 117/66
B05D 1/36 (2006.01) B05D 5/12 (2006.01) B32B 38/10 (2006.01) H05K 3/04 (2006.01) H05K 3/10 (2006.01) H05K 3/12 (2006.01)
Patent
CA 2014649
ABSTRACT A fabrication method for applying conductive traces to a substrate is described. The method uses an ink which is applied to a substrate by an ink jet delivery system. The ink includes an adhesive in combination with other additives, including one or more solvents. The ink is delivered by the ink jet system in a selected pattern, followed by placement on the pattern of a flexible film sheet having a layer of metal thereon. The film is urged downward onto the pattern with the application of heat and pressure. This causes adhesion of the layer of metal to the adhesive in the ink. The film is then removed, leaving a coating of metal on the pattern, thereby producing conductive trace patterns in a rapid and efficient manner.
Chieng Ching K.
Cloutier Frank L.
Min Siow W.
Chieng Ching K.
Cloutier Frank L.
Hewlett-Packard Company
Min Siow W.
Sim & Mcburney
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