H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/60 (2006.01) H01L 21/48 (2006.01) H01L 21/56 (2006.01) H01L 23/373 (2006.01)
Patent
CA 2611304
Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
L'invention concerne des procédés de formation d'un dispositif électronique qui comprend un matériau qui fonctionne comme un matériau de remplissage sous-jacent ainsi que comme un matériau d'interface thermique, simultanément. L'invention concerne également un ensemble électronique comprenant un élément dissipateur de chaleur, une puce semi-conductrice, un substrat et un matériau thermoconducteur, le matériau thermoconducteur servant de matériau de remplissage sous-jacent ainsi que de matériau d'interface thermique, simultanément.
Campbell John Robert
Esler David Richard
Gowda Arun Virupaksha
Latham Stephen Andrew
Mills Ryan Christopher
Company General Electric
Mcfadden Fincham
Momentive Performance Materials Inc.
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