Method for making multilayer circuits using embedded...

Details Method for making multilayer circuits using embedded... Method for making multilayer circuits using embedded...

H - Electricity

05

K

356/16

H05K 3/46 (2006.01) G03F 7/004 (2006.01) H05K 1/00 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1275740

TITLE METHOD FOR MAKING MULTILAYER CIRCUITS USING EMBEDDED CATALYST RECEPTORS ABSTRACT The invention is directed to d laminate for the preparation of a multilayer printed circuit by electroless plating of conductive metal thereon which comprises a. a substrate having formed on a surface thereof b. a conductive pattern, and, c. overlying the pattern and surrounding substrate areas. a layer of tonable photodielectric material having partially embedded therein finely divided particles of adsorbent which protrude from the layer surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof.

555091

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