Method for preparing multilayer dielectric powder condensers

Details Method for preparing multilayer dielectric powder condensers Method for preparing multilayer dielectric powder condensers

H - Electricity

01

G

H01G 4/06 (2006.01) H01G 4/30 (2006.01)

Patent

CA 2119797

ABSTRACT The object of the present invention is to provide a method for preparing small-size and large capacity multilayer dielectric powder condensers capable of employing as the inner electrode materials inexpensive copper alloys or nickel alloys. The method for preparing multilayer dielectric powder condensers according to the present invention comprises steps of: providing a fine dielectric powder having a dielectric film on the surface of a metal powder or a semiconductor powder; preparing a pasty material by kneading the dielectric powder with an organic binder; forming a filmy sheet from the pasty material; applying a paste containing a metal powder for forming electrode on the surface of the filmy sheet and drying the applied sheet; piling a plurality of the sheets; placing the piled sheets between thin glass sheets made from a paste prepared by kneading a glass powder and an organic binder and pressing them together; and subjecting the piled and pressed sheets to a heat-treatment.

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