Method for producing solderable and functional surfaces on...

Details Method for producing solderable and functional surfaces on... Method for producing solderable and functional surfaces on...

H - Electricity

05

K

H05K 3/24 (2006.01)

Patent

CA 2365701

The inventive method provides solderable areas in addition to bondable areas on circuit carriers, wherein solderability is not impaired by exposing the circuit carriers to the effects of temperature. The inventive method comprises the following steps: solderable surfaces are produced by deposition of a solderable metal layer (5), the solder areas are covered by a mask (6), functional surfaces (7, 8) are created in the functional areas and the covering mask (6) is finally removed.

Le procédé selon l'invention permet de réaliser des zones aptes au brasage en plus de zones aptes à la métallisation, sur des supports de circuit, l'aptitude au brasage n'étant pas réduite même par une sollicitation thermique des supports de circuit. Le procédé présenté comporte les étapes suivantes: réalisation de surfaces aptes au brasage par dépôt d'une couche métallique (5) apte au brasage; couverture des zones de brasage au moyen d'un masque (6); réalisation des surfaces fonctionnelles (7, 8) dans les zones fonctionnelles; et enfin retrait du masque (6).

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