Method for the encapsulation of components or elecetronic...

Details Method for the encapsulation of components or elecetronic... Method for the encapsulation of components or elecetronic...

H - Electricity

01

L

H01L 23/29 (2006.01) H01L 23/31 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2154480

Method for the encapsulation of electronic components or an electronic unit fitted on a support such as a printed circuit board, consisting in depositing on the components or electronic unit at least two organic layers (15', 18'). The invention is characterized in that a polyurethane-based material, especially a hydroxylateed polyurethane polybutadiene, is selected to form one of the two layers (15').

Procédé d'encapsulation de composants électroniques ou d'un module électronique montés sur un support tel qu'une carte à circuit imprimé, du type consistant à déposer sur les composants ou le module électronique au moins deux couches organiques (15', 18'), caractérisé en ce qu'il consiste à choisir un matériau à base de polyuréthane pour constituer l'une de ces deux couches (15'), en particulier du polyuréthane polybutadiène hydroxylé.

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