Method of and apparatus for applying voltage to...

Details Method of and apparatus for applying voltage to... Method of and apparatus for applying voltage to...

H - Electricity

05

F

317/3

H05F 3/00 (2006.01) B23Q 3/15 (2006.01)

Patent

CA 2015383

ABSTRACT OF THE DISCLOSURE A first voltage is first applied to the electrode or electrodes of an electrostatic chuck for electro- statically attracting a workpiece such as a silicon wafer. Then, before the workpiece is removed from the electrostatic chuck, a second voltage which is of opposite polarity to the first voltage is applied to the electrostatic chuck for eliminating a residual attractive force from the electro- static chuck. The second voltage has a voltage value which is 1.5 to 2 times higher than the voltage value of the first voltage. The second voltage is continuously applied for a period of time which is in inverse proportion to the voltage value of the second voltage. - 17 -

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