C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/73, 117/114.
C23C 26/02 (2006.01) C23C 6/00 (2006.01)
Patent
CA 2028296
ABSTRACT OF THE DISCLOSURE The present invention is a method which puts a solid plating metal on the surface of the passing metal sheet to melt it by a heat of the metal sheet, and adheres the molten metal as a plating film to the metal surface. According to this plating method, a hot dip metal bath is not required at all, and the plated film with the molten metal may be produced without troubl- ing many problems involved with using the molten metal bath.
Mithitaka Sakurai
Syunichi Sugiyama
Takeo Kusaka
Toshio Ishii
Yasuhisa Tajiri
Mithitaka Sakurai
Nkk Corporation
Swabey Ogilvy Renault
Syunichi Sugiyama
Takeo Kusaka
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