Method of continuously plating metal sheets

C - Chemistry – Metallurgy – 23 – C

Patent

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117/114.1

C23C 26/02 (2006.01) C23C 6/00 (2006.01)

Patent

CA 2028295

ABSTRACT OF THE DISCLOSURE This invention is a plating method which melts a solid plating metal by a required plating amount toward a running metal strip and adheres the molten plating metal to a strip surface. According to this method, a hot dip plating bath is not required at all, and a plated film may be formed without troubling problems which have been involved with using of the hot dip plating bath.

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Profile ID: LFCA-PAI-O-2052026

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