C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/114.1
C23C 26/02 (2006.01) C23C 6/00 (2006.01)
Patent
CA 2028295
ABSTRACT OF THE DISCLOSURE This invention is a plating method which melts a solid plating metal by a required plating amount toward a running metal strip and adheres the molten plating metal to a strip surface. According to this method, a hot dip plating bath is not required at all, and a plated film may be formed without troubling problems which have been involved with using of the hot dip plating bath.
Mithitaka Sakurai
Syunichi Sugiyama
Takeo Kusaka
Toshio Ishii
Yasuhisa Tajiri
Mithitaka Sakurai
Nkk Corporation
Swabey Ogilvy Renault
Syunichi Sugiyama
Takeo Kusaka
LandOfFree
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