Method of electroplating a substrate, and products made thereby

Details Method of electroplating a substrate, and products made thereby Method of electroplating a substrate, and products made thereby

C - Chemistry, Metallurgy

25

D

C25D 5/54 (2006.01) C25D 5/00 (2006.01)

Patent

CA 2218392

Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J0, to form a conductive metal layer (30) having a surface roughness no greater than the surface roughness (20) of the underlying member (10). In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.

L'invention concerne un procédé de revêtement électrolytique, ainsi que les produits obtenus au moyen de ce procédé, procédé qui, dans un mode de réalisation, consiste à utiliser une densité J¿0? de courant, afin de créer une couche conductrice en métal (30) possédant une rugosité de surface non supérieure à celle de la rugosité de surface (20) de l'élément sous-jacent (10). Dans un autre mode de réalisation de revêtement électrolytique de la surface d'un substrat possédant des creux et des pointes, le procédé consiste à effectuer le revêtement électrolytique des pointes avec un métal conducteur, afin de les recouvrir avec ledit métal, ainsi que des creux, afin de pratiquement les remplir avec ledit métal.

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