Method of isolating functional regions of an integrated circuit

Details Method of isolating functional regions of an integrated circuit Method of isolating functional regions of an integrated circuit

H - Electricity

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356/147

H01L 21/76 (2006.01) H01L 21/764 (2006.01) H01L 23/48 (2006.01) H01L 23/522 (2006.01) H01L 27/14 (2006.01) H01L 27/148 (2006.01)

Patent

CA 1291579

11 Abstract An integrated circuit formed in a semiconduc- tor die which has at least two distinct functional regions is treated by mounting the die by way of its front face on a support member, and subsequent- ly removing die material by way of its back face so as to physically separate the functional regions of the die from each other.

581232

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