H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/10 (2006.01) H05K 1/00 (2006.01) H05K 3/20 (2006.01) H05K 3/24 (2006.01) H05K 3/04 (2006.01)
Patent
CA 2387012
A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.
Hashimoto Takuma
Kimura Hideyoshi
Kobayashi Mitsuru
Nakagawa Kazuya
Shiohama Eiji
Marks & Clerk
Matsushita Electric Works Ltd.
LandOfFree
Method of manufacturing printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed wiring board will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1415859