Method of treatment with a microwave plasma

H - Electricity – 01 – L

Patent

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Details

H01L 21/36 (2006.01) C23C 16/04 (2006.01) C23C 16/26 (2006.01) C23C 16/511 (2006.01) H01J 37/32 (2006.01) H01L 21/46 (2006.01)

Patent

CA 2366175

Disclosed is a method of treatment with a microwave plasma by maintaining a reduced pressure in a plasma-treating chamber for treatment with a plasma in which a substrate that is to be treated with a microwave plasma is contained, introducing a treating gas into the plasma-treating chamber and introducing microwaves into the plasma-treating chamber, wherein a metallic antenna is disposed in the plasma-treating chamber. The plasma is generated within a very short period of time maintaining stability after the microwaves are introduced into the plasma-treating chamber, and the treatment is accomplished maintaining stability.

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