Methods and apparatus for the cooling of filaments in a...

C - Chemistry – Metallurgy – 03 – B

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C03B 37/02 (2006.01)

Patent

CA 2429626

Cooling systems and the methods of cooling filaments using the cooling systems are disclosed. One embodiment of the cooling system includes a layer of nozzles (130) that spray air on the filaments (30) above a pre-pad water spray. Alternatively, another cooling system utilizes air-atomizing nozzles to spray a mixture of air and water on the filaments. The cooling systems provide an improved distribution of cooling fluid particulars to enhance the cooling of the filaments. The sprays from the nozzles have a higher momentum and are able to penetrate deeper into a filament fan than conventional cooling systems. The results are an improved temperature uniformity among the filaments and an overall reduction in temperature of the filaments prior to the application of size material.

L'invention concerne des systèmes de refroidissement et des procédés de refroidissement de filaments utilisant ces systèmes. Dans une réalisation, le système de refroidissement comprend une couche de buses (130) qui pulvérisent de l'air sur les filaments (30) au dessus d'une pulvérisation d'eau de l'organe d'assemblage. Dans une autre réalisation, un autre système de refroidissement utilise des buses d'atomisation d'air afin de pulvériser un mélange d'air et d'eau sur les filaments. Les systèmes de refroidissement mettent en oeuvre un distribution améliorée de particules de liquide de refroidissement afin d'améliorer le refroidissement des filaments. Les jets sortant des buses possèdent un moment plus élevé et peuvent pénétrer plus profondément dans un éventail de filaments que les systèmes de refroidissement classiques. Il en résulte une meilleure uniformité de température parmi les filaments et une diminution globale de la température des filaments avant application d'un matériau d'enduction.

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