H - Electricity
01
L
H01L 45/00 (2006.01) B81B 3/00 (2006.01) H01H 45/00 (2006.01) H01H 59/00 (2006.01)
Patent
CA 2361756
A microstructure relay comprising an s-shaped support member is provided. The s-shape support member creates over-travel in the relay in order to produce high contact force and low contact resistance over the lifetime of the relay. Compressive and tensile stress-inducing layers on appropriate parts of the support member induce it to bend as desired.
L'invention concerne un relais à microstructure, qui comprend un élément support en forme de S. Cet élément crée une <= sur-course >= dans le relais afin de produire une force de contact élevée et une faible résistance de contact tout au long de la durée de vie du relais. Des couches exerçant une contrainte de compression et de traction sur des parties adéquates de l'élément support, permettent de fléchir ce dernier selon les besoins.
Foo Pang Dow
Krupka Kay
Schlaak Helmut
Sridhar Uppili
Victor D. Samper
Institute Of Microelectronics
Smart & Biggar
Tyco Electronics Logistics Ag
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