Moisture-curing hotmelt adhesives, their preparation and use

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 175/06 (2006.01) C08G 18/42 (2006.01) C08G 18/76 (2006.01)

Patent

CA 2556545

The invention relates to moisture-hardening hot-melt adhesives for instantaneously processing bonded substrates containing reaction products obtainable by the reaction of bifunctional- and/or multifunctional (poly- )isocyanates with hydroxyl polyesters based on polyols and dicarboxylic acids. According to said invention, the dicarboxylic acid is embodied in the form of a linear aliphatic dicarboxylic acid containing from 13 to 22 methylene groups.

L'invention concerne des adhésifs thermofusibles réticulables à l'humidité pour l'usinage immédiat des substrats collés. Les adhésifs thermofusibles selon l'invention contiennent des produits issus de la réaction de (poly)isocyanates bifonctionnels et/ou multifonctionnels avec des polyesters d'hydroxyle à base de polyols et d'acides dicarboxyliques. Selon l'invention, on utilise comme acide dicarboxylique un acide dicarboxylique aliphatique linéaire ayant 13 à 22 groupes méthylène.

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