Mosfet and method for manufacturing mosfet

H - Electricity – 01 – L

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Details

H01L 29/12 (2006.01) H01L 21/318 (2006.01) H01L 21/336 (2006.01) H01L 29/78 (2006.01)

Patent

CA 2736950

A MOSFET 1 includes: a silicon carbide (SiC) substrate (2) having a main surface having an off angle of not less than 50° and not more than 65° relative to a {0001} plane, a semiconductor layer (21) formed on the main surface of the SiC substrate (2); and an insulating film (26) formed in contact with a surface of the semiconductor layer (21). The MOSFET 1 has a sub-threshold slope of not more than 0.4 V/Decade.

L'invention concerne un transistor MOS (1) qui comprend : un substrat de carbure de silicium (SiC) (2) dont l'angle d'inclinaison de sa surface principale est non inférieur à 50°, mais n'excède par 65° par rapport au plan {0001}, une couche de semi-conducteurs (21) formée sur la surface principale du substrat SiC (2) et un film isolant (26) formé de manière à être en contact avec la surface de la couche de semi-conducteurs (21). La pente sous le seuil du transistor MOS (1) n'excède pas 0,4 V/décade.

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