H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 31/0203 (2006.01) G11C 16/06 (2006.01) H01L 23/04 (2006.01) H01L 23/28 (2006.01)
Patent
CA 2301613
A mounting for a flip chip integrated circuit device having a light sensitive cell is disclosed. The mounting includes an insulating substrate having an aperture between its first and second surfaces. A flip chip integrated circuit device is placed on the first surface of the substrate. A light sensitive cell of the integrated circuit device faces the aperture. Solder bumps on the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A transparent aperture cover is affixed to the second surface of the substrate with an adhesive bead. The aperture cover extends over the aperture, allowing light to be transmitted through the aperture cover to the light sensitive cell. The side surfaces of the aperture cover include features for locking the adhesive bead to the aperture cover. The numerous locking features disclosed include protrusions and indentations that engage the adhesive bead and thereby enhance the connection of the aperture cover to the substrate.
L'invention porte sur un montage de circuit intégré à puces à bosses à cellule photosensible comportant un substrat isolant percé d'une ouverture entre sa première et sa deuxième surface. Un circuit intégré à puces à bosses est disposé sur la première surface du substrat, tandis que la cellule photosensible dudit circuit intégré est placée face à l'ouverture. Les perles de soudure du circuit intégré sont reliées électriquement aux parties métalliques correspondantes de la première surface du substrat. Un couvre-ouverture est fixé à la deuxième surface à l'aide d'un cordon adhésif. Ledit couvre-ouverture permet à la lumière de le traverser et d'atteindre la cellule photosensible. Les surfaces latérales du couvre-ouverture comportent des moyens de fixation du cordon adhésif au couvre-ouverture lesquels présentent des parties saillantes et rentrantes en contact avec le cordon adhésif qui renforcent la fixation du couvre-ouverture au substrat.
Amkor Technology Inc.
Smart & Biggar
LandOfFree
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