H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/12 (2006.01) H01L 21/56 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01) H05K 1/14 (2006.01) H05K 1/18 (2006.01) H05K 3/34 (2006.01) H05K 3/28 (2006.01) H05K 3/36 (2006.01)
Patent
CA 2242802
A mounting structure wherein, in a semiconductor package mounting position on a wiring board, a package bearing substrate whose external size is substantially equal to or larger than that of the semiconductor package and which has on its upper surface pads for connection to a semiconductor package and on its lower surface pads for connection to the wiring board is arranged, the pads on the wiring board and those on the lower surface of the package bearing substrate are connected by soldering, and the soldered junction is filled and fixed with an under-fill.
Structure de montage, dans une position de montage d'un boîtier semi-conducteur sur un tableau de connexion. La structure comprend un substrat porteur dont la dimension extérieure est essentiellement égale à celle du boîtier semi-conducteur ou plus large. Elle comprend également des pastilles sur sa surface supérieure pour un raccord au boîtier semi-conducteur et des pastilles sur sa surface inférieure pour un raccord au tableau de connexion. Les pastilles sur le tableau de connexion et celles sur la surface inférieure du substrat porteur sont raccordées par soudure, et le joint soudé est rempli et fixé avec un manque de métal.
Ikeda Hironobu
Yamaguti Yukio
Corporation Nec
Smart & Biggar
LandOfFree
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