4. H - Electricity
  5. 01
  6. R

Yukio Yamaguti

H - Electricity – 01 – R

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Country: Japan

Integrated circuit chip carrier and its packaging

H - Electricity – 01 – R
Patent

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Mounting structure for one or more semiconductor devices

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Semiconductor device

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Profile ID: LFCA-PAI-P-1264953

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