H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H01L 23/12 (2006.01) H01L 23/498 (2006.01) H05K 1/00 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2462130
A multi-layered circuit wiring plate includes a plurality of films (131a, 131b, 131c) stacked on one another. Wiring patterns (17a, 17b, 21, 23) are formed on at least one of the surfaces of each of the films (131a, 131b, 131c). The wiring patterns (17a, 17b, 21, 23) formed on the surfaces of the adjacent films (131a, 131b, 131c) are electrically connected via a via contact layer (19a, 19b) formed on one of the films (131a, 131b, 131c).
L'invention concerne une plaque d'enroulement de circuit multicouche comportant une pluralité de films (131, 131b, 131c) empilés les uns sur les autres. Les modèles d'enroulement (17a, 17b, 21, 23) sont formés sur au moins une des surfaces de chaque film (131a, 131b, 131c). Les modèles d'enroulement (17a, 17b, 21, 23) formés sur les surfaces des films adjacents (131a, 131b, 131c) sont connectés électriquement via une couche de contact de trou de connexion (19a, 19b) pratiqué sur un des films (131a, 131b, 131c).
Akimoto Satoshi
Maehara Masataka
Matsuzawa Hiroshi
Ode Masayuki
Sakaki Yuichi
Fetherstonhaugh & Co.
Toppan Printing Co. Ltd.
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