Multilayer board and fabrication method thereof

Details Multilayer board and fabrication method thereof Multilayer board and fabrication method thereof

H - Electricity

05

K

H05K 1/02 (2006.01)

Patent

CA 2094754

Abstract of the Disclosure: A multilayer board includes: a smooth-surfaced double-sided board having: a base material provided with a hole penetrating therethrough, a first layer wiring pattern provided on both surfaces of the base material and having a surface, and a conductive material filled in the hole, the filler having ends being substantially flush with the surface of the first layer wiring pattern, thus forming a via hole portion having ends; an insulat- ing layer provided on at least one surface of the base douboe-sided board, the insulating layer being formed with an opening having an inner wall; and a second layer wiring pattern comprising a plating layer provided on the double-sided board through the insulating layer; wherein at least a portion of one of the ends of the via hole portion is exposed in the opening, and wherein the inner wall of the opening and exposed portion of the end of the via hole portion is coated with a plating layer connect- ing to the plating layer of the second layer wiring pattern, thus establishing electrical connection between the second wiring pattern and the via hole portion.

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