Non-aqueous microelectronic cleaning compositions containing...

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G - Physics

03

F

G03F 7/42 (2006.01) C11D 11/00 (2006.01) H01L 21/3213 (2006.01)

Patent

CA 2573788

Back end photoresist strippers and residue compositions are provided by non- aqueous compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise a polar organic solvent, a hydroxylated amine, and as a corrosion inhibitor fructose.

La présente invention décrit des solutions non aqueuses qui ne provoquent aucune corrosion du cuivre ou de l'aluminium. Ces solutions sont composées d'un solvant organique polaire, d'une amine hydroxylée et de fructose en tant qu'inhibiteur de corrosion. Elles peuvent être employées dans des applications en microélectronique, notamment en phase de back-end pour le décapage du photorésist ainsi que l~élimination des résidus.

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