Non-aqueous, non-corrosive microelectronic cleaning...

Details Non-aqueous, non-corrosive microelectronic cleaning... Non-aqueous, non-corrosive microelectronic cleaning...

H - Electricity

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H01L 21/00 (2006.01) C11D 7/22 (2006.01) C11D 7/50 (2006.01) C23G 1/00 (2006.01) G03F 7/42 (2006.01) H01L 21/3213 (2006.01)

Patent

CA 2591477

Photoresist strippers and cleaning compositions of this invention are provided by non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor polymer having multiple hydroxyl- or amino- functional groups pendant from the polymer backbone.

Les décapants de résine photosensible et les compositions de nettoyage de la présente invention sont fournis par des compositions non aqueuses de nettoyage qui sont essentiellement non corrosives envers le cuivre ainsi que l'aluminium et qui comprennent au moins un solvant organique polaire, au moins une amine organique hydroxylée, et au moins un polymère inhibiteur de corrosion possédant une multitude de groupes fonctionnels hydroxyle ou amino pendants par rapport au squelette du polymère.

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