H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/174
H01L 29/20 (2006.01) H01L 21/203 (2006.01) H01L 21/285 (2006.01) H01L 29/45 (2006.01) H01L 29/812 (2006.01)
Patent
CA 1125924
- 1 - Abstract: A nonalloyed ohmic contact to an n-type Group III(a)-V(a) compound semiconductor body is formed by epitaxially growing a Group III(a)-V(a) n++-layer doped to at least 1019 cm-3 between the semiconductor body and a metal contact layer. The metal layer forms an ohmic contact without requiring heating above the eutec- tic temperature. In order to avoid contamination of the metal-semiconductor interface, a metal contact layer may be deposited in situ after MBE growth of the n++-layer. This technique results in both a metal-semiconductor interface with smoother morphology and also an ohmic contact without heating above the eutectic temperature. These procedures are specifically described with refer- ence to the fabrication of GaAs FETs.
328207
Cho Alfred Y.
Dilorenzo James V.
Niehaus William C.
Kirby Eades Gale Baker
Western Electric Company Incorporated
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