Novel demetallizing apparatus

C - Chemistry – Metallurgy – 23 – F

Patent

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Details

C23F 1/08 (2006.01) C23F 1/36 (2006.01)

Patent

CA 2280470

Selective demetallization of an etchable metal layer supported on a polymeric material or other microwave transparent material, or a self-supporting etchable metal layer, particularly aluminium of thickness at least about 1 micron adhesively joined to a flexible polymeric material substrate, is described. A web of polymeric material bearing the etchable metal layer, or an unsupported etchable metal layer, has a pattern of etchant--resistant material first applied and then the web is immersed in and passed through a bath of aqueous etchant, particularly hot aqueous sodium hydroxide solution, for a time at least sufficient to completely remove the etchable metal from non-protected areas of the web. The demetallized web is washed and dried. Specific structure incorporating the selectively demetallized etchable metal layer also are described.

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