Novolak resin for positive photoresist

Details Novolak resin for positive photoresist Novolak resin for positive photoresist

C - Chemistry, Metallurgy

08

G

402/52, 402/57

C08G 8/08 (2006.01) C08G 8/00 (2006.01) G03F 7/016 (2006.01) G03F 7/023 (2006.01)

Patent

CA 1287438

ABSTRACT A novolak resin for a positive photoresist is produced by addition condensation reaction of a phenol with formaldehyde. The area ratio of the gel permeation chromatographic pattern (GPC pattern) measured by the use of an UV(254 nm) detector is a range wherein the molecular weight calculated as polystyrene is from 150 to less than 500 (not including a phenol and the unreacted monomer) is from 8 to 35% (hereinafter referred to as A region), a range wherein the molecular weight calculated as polystyrene is from 500 to less than 5000 is from 0 to 30% (hereinafter referred to as B region) and a range wherein the molecular weight calculated as polystyrene exceeds 5000 is from 35 to 92% (hereinafter referred to as C region), the ratio of the B region to the A region being 2.50 or less.

551269

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