Optical fiber array module using soldering and fabrication...

Details Optical fiber array module using soldering and fabrication... Optical fiber array module using soldering and fabrication...

G - Physics

02

B

G02B 6/42 (2006.01) G02B 6/38 (2006.01) G02B 6/40 (2006.01)

Patent

CA 2244633

A fiber array module using soldering, and a fabrication method thereof, are provided. This method includes the steps of forming holes into which optical fibers can be inserted, in a silicon wafer or a ceramic substrate at predetermined intervals, forming a metal layer on the walls of the holes and the entire surface of the substrate, to allow the walls of the holes and the entire surface of the substrate to be plated with a solder alloy material, plating the walls of the holes and the entire surface of the substrate with the solder alloy material, inserting metal-coated optical fibers into the holes plated with the solder alloy material, positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure, fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring epoxy curable by heat or ultraviolet, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device, and polishing the end of the optical fiber module formed of optical fibers protruding through the holes, to give optical luminance. Accordingly, the environmental characteristics and reliability of a device package are improved upon the connection of the optical fibers. Also, the fiber array module is simply manufactured, and the ends of loaded optical fibers are easily polished, thus fabricating a cheap connection module. Furthermore, the optical fibers are accurately arrayed by the self-alignment using the surface tension of the solder material. 7

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