Package modification for channel-routed circuit boards

H - Electricity – 01 – L

Patent

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Details

H01L 23/48 (2006.01) H05K 1/11 (2006.01) H05K 3/30 (2006.01) H05K 13/04 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2465448

A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vial penetrating at least one layer of the circuit board and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board. The method comprises the step of forming at least one pin of the plurality of pins of the circuit component to have a length compatible with a depth of a corresponding via of the circuit board.

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