Palladium surface coatings suitable for wirebonding and...

Details Palladium surface coatings suitable for wirebonding and... Palladium surface coatings suitable for wirebonding and...

C - Chemistry, Metallurgy

25

D

C25D 3/50 (2006.01) C25D 3/52 (2006.01) C25D 5/10 (2006.01) C25D 5/12 (2006.01) C25D 5/16 (2006.01) C25D 7/00 (2006.01) H01L 21/48 (2006.01) H01L 21/607 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2270303

A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN50) while at least one material layer has a hardness that is less than about 250 (KHN50).

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