Panelboard with friction surface

B - Operations – Transporting – 32 – B

Patent

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Details

154/78, 20/38.1

B32B 3/28 (2006.01) B27N 3/20 (2006.01) B32B 21/00 (2006.01) E04B 7/20 (2006.01) E04C 2/16 (2006.01)

Patent

CA 1178521

ABSTRACT OF THE DISCLOSURE . A waferboard panel is disclosed and a method of making the panel having a friction surface on at least one side. The friction surface retains the water resistant properties of the panel surface and allows a firm footing when the panel is used in sloped roofs. The waferboard panel has at least: one surface being a friction surface comprising a plurality of raised protrusions spaced apart in a predetermined pattern. The process of making the panel comprises the steps of assembling wood wafers coated with an adhesive binder into a mat with a plate, the plate having a surface adjacent the mat with a plurality of indentations or holes therein in a predetermined pattern, and pressing the mat in a press at a high temperature with the plate adjacent the mat to form the wafers into a waferboard panel such that the friction surface of the waferboard panel has a plurality of raised protrusions spaced apart in a predetermined pattern.

404659

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