Pb-free soldering alloy

Details Pb-free soldering alloy Pb-free soldering alloy

B - Operations, Transporting

23

K

B23K 35/26 (2006.01)

Patent

CA 2347194

The present invention proposes Pb-free soldering alloy which does not comprise any amount of Pb to prevent the environment from being contaminated by Pb when the soldered product is put on a wasteyard and to enhance the mechanical strength at the soldered joint by the soldering alloy. The Pb-free soldering alloy is characterized in that it comprises Cu in 0.05 to 2.0 wt.%, Ni in 0.001 to 2.0 wt.% and Sn in the balance.

Alliage de soudure sans plomb caractérisé par la composition suivante: Cu: 0,05 à 2 % en poids, Ni: 0,001 à 2 % en poids, le reste de la composition consistant en Sn. Cet alliage de soudure est totalement exempt de Pb et, de ce fait, ne provoque aucune pollution de l'environnement par le plomb. De plus, cet alliage peut conférer une résistance mécanique améliorée à une pièce de joint soudée du fait de sa composition.

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