Permanent metallic bonding method

Details Permanent metallic bonding method Permanent metallic bonding method

B - Operations, Transporting

23

K

B23K 35/24 (2006.01) B23K 20/02 (2006.01) B23K 20/233 (2006.01) B23K 35/00 (2006.01) H01L 21/3205 (2006.01) H01L 21/58 (2006.01) H01L 23/373 (2006.01) H01S 5/022 (2006.01) H01L 33/00 (2006.01) H01S 5/02 (2006.01) H01S 3/025 (1995.01)

Patent

CA 2099049

A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount, followed by (2) depositing a wetting layer on the auxiliary layer, and (3) by depositing a solder layer comprising alternating metallic layers, preferably of gold and tin sufficient to form an overall tin-rich gold-tin eutectic composition. The barrier metal is typically W, Mo, Cr, or Ru. Prior to bonding, a conventional metallization such as Ti-Pt-Au (three layers) is deposited on the laser device's bottom ohmic contact, typically comprising Ge. Then, during bonding, the solder layer is brought into physical contact with the laser device's metallization under enough heat and pressure, followed by cooling, to form a permanent joint between them. The thickness of the solder layer is advantageously less than approximately 5 µm. The wetting layer is preferably the intermetallic compound Ni3, and the auxiliary layer is formed by codepositing the metallic components of this intermetallic together with the barrier metal.

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