C - Chemistry – Metallurgy – 11 – D
Patent
C - Chemistry, Metallurgy
11
D
C11D 7/08 (2006.01) C11D 7/14 (2006.01) C11D 7/32 (2006.01) C11D 11/00 (2006.01)
Patent
CA 2677964
Highly alkaline, aqueous formulations including (a) water, (b) at least one metal ion-free base at sufficient amounts to produce a final formulation alkaline pH, (c) from about 0.01% to about 5% by weight (expressed as % SiO2) of at least one water-soluble metal ion-free silicate corrosion inhibitors; (d) from about 0.01% to about 10% by weight of at least one metal chelating agent, and (e) from more than 0 to about 2.0% by weight of at least one oxymetalate are provided in accordance with this invention. Such formulations are combined with a peroxide such that a peroxymetalate is formed to produce form a microelectronic cleaning composition. Used to remove contaminants and residue from microelectronic devices, such as microelectronic substrates.
L'invention concerne des formulations aqueuses, très alcalines qui incluent (a) de l'eau, (b) au moins une base dépourvue d'ions métalliques en quantité suffisante pour produire une formulation finale au pH alcalin, (c) d'environ 0,01 % à environ 5 % en poids (exprimé en % de SiO2) d'au moins un agent chélateur de métal, et (e) entre 0 et environ 2,0 % en poids d'au moins un oxymétalate. De telles formulations sont combinées avec un peroxyde tel qu'un peroxymétalate est formé pour produire une composition de nettoyage microélectronique. Cette composition est utile pour éliminer des contaminants et des résidus de dispositifs microélectroniques, tels des substrats microélectroniques.
Avantor Performance Materials Inc.
Mallinckrodt Baker Inc.
Osler Hoskin & Harcourt Llp
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