C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
402/404, 204/91.
C08F 2/50 (2006.01) C08F 220/10 (2006.01) C08F 222/10 (2006.01) C08J 3/28 (2006.01) C08J 7/18 (2006.01) C09D 4/00 (2006.01) G03F 7/00 (2006.01) G03F 7/027 (2006.01)
Patent
CA 2007295
The invention relates to a liquid resin composition which can be polymerized by radiation and which contains (i) a difunctional monomeric or polymeric acrylate or methacrylate, (ii) a tri- or polyfunctional acrylate or methacrylate, (iii) at least one unsaturated monofunctional monomeric compound of the formula VI Image wherein R5 denotes hydrogen or methyl and R6 is a group of the formula VII Image R7 being tetrahydrofurfuryl, cyclohexyl, 2-phenoxyethyl, benzyl, isobornyl, glycidyl, dicyclopentenyl, morpholinoethyl, dimethylaminoethyl, diethylaminoethyl or a C1-C20 linear or branched aliphatic residue, or - if R5 is hydrogen R6 denotes additionally pyrrolidinon-2-yl, imidazonyl, carbazolyl, anthracenyl, phenyl, C5-C8cycloalkyl, naphthenyl, 2-norbornyl, pyridyl, N-caprolactamyl or toluyl and (iv) a photo-polymerization initiator for (i), (ii) and/or (iii). Such compositions are suitable in the stereolithographic process, as coatings or as adhesives.
Bernhard Paul
Hofmann Manfred
Hunziker Max
Klingert Bernd
Leyden Richard Noel
Fetherstonhaugh & Co.
Vantico Ag
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