Physical vapour deposition process for depositing erosion...

Details Physical vapour deposition process for depositing erosion... Physical vapour deposition process for depositing erosion...

C - Chemistry, Metallurgy

23

C

C23C 14/22 (2006.01) C23C 14/16 (2006.01) C23C 14/34 (2006.01)

Patent

CA 2600097

An improved process of coating a substrate by physical vapour deposition with a coating selected from the group consisting of MAIN and MN, wherein M is selected from the group consisting of Ti, Cr and Zr, the process comprising (i) loading the substrate in a vacuum chamber (ii) locating at least one metallic cathode selected from the group consisting of M and MAI within the vacuum chamber; (iii) providing the vacuum chamber with a nitrogen gas atmosphere; and (iv) vapourizing the cathode in the nitrogen atmosphere; the improvement comprising setting the total cathode current ratios to a desired value, and applying a negative bias voltage selected from -75V to -10V to the substrate during the vapourizing step (iii).

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