Planarized plastic modules for integrated circuits

Details Planarized plastic modules for integrated circuits Planarized plastic modules for integrated circuits

H - Electricity

01

L

H01L 23/28 (2006.01) H01L 23/02 (2006.01) H01L 23/16 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2350057

A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

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