H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/28 (2006.01) H01L 23/02 (2006.01) H01L 23/16 (2006.01) H01L 23/495 (2006.01)
Patent
CA 2350057
A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
Caletka David V.
Carper James L.
Cincotta John P.
Horsford Kibby B.
Irish Gary H.
Barrett B.p.
International Business Machines Corporation
Vadnais Michael J.
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