Plasma source and method for removing materials from...

C - Chemistry – Metallurgy – 23 – F

Patent

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C23F 4/04 (2006.01) H01H 1/24 (2006.01) H01L 21/3065 (2006.01)

Patent

CA 2751709

In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.

La présente invention concerne un procédé destiné à éliminer un matériau d'un substrat, permettant de produire un plasma sous pression atmosphérique. Ledit plasma comprend une espèce énergétique réactive avec un ou plusieurs composants du matériau. Ledit plasma s'écoule depuis un orifice de sortie en tant que panache de plasma comprenant des régions périodiques de plasma de haute densité et de plasma de basse densité. Le matériau est exposé au panache de plasma. Au moins un composant du matériau réagit avec l'espèce énergétique et au moins un autre composant du matériau est physiquement impacté et déplacé par une ou plusieurs régions de plasma de haute densité.

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